cystech electronics corp. spec. no. : c469j3 issued date : 2009.07.03 revised date : page no. : 1/6 CSK1040J3 cystek product specification 10amp. schottky barrier rectifiers CSK1040J3 features ? excellent power dissipation offers better re verse leakage current and thermal resistance ? low profile surface mount applicati on in order to optimize board space ? metal silicon junction, major carrier conduction ? 10a total (5a per diode leg) ? guardring for over voltage protection ? low power loss, high efficiency ? high surge capability ? high current capability, low forward voltage drop ? ultra-high speed switching ? lead-free parts meet environm ental standard mil-std-19500 /228 mechanical data ? case: molded plastic, to-252 ? mounting position: any ? weight: 0.34 grams approximately ? terminals: pure tin plated, lead-fre e, solderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? polarity : indicated by diode symbol equivalent circuit outline CSK1040J3 to-252 a k a
cystech electronics corp. spec. no. : c469j3 issued date : 2009.07.03 revised date : page no. : 2/6 CSK1040J3 cystek product specification maximum ratings and electrical ch aracteristics (per diode leg) ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol limits units maximum recurrent peak reverse voltage v rrm 40 v maximum rms voltage v rms 28 v maximum dc blocking voltage v dc 40 v maximum instantaneous forward voltage at i f =5a v f 0.55 v per diode 5 maximum average forward rectified current per device i f(av) 10 a non-repetitive peak forward surge current @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 100 a 0.5 maximum instantaneous reverse current at v r =40v, t a = 25 v r =40v, t a = 100 i r 20 ma maximum thermal resistance, junction-to-case r jc 3 c/w maximum thermal resistance, junction-to-ambient r ja 125 c/w storage temperature range t stg -65 ~ +175 operating junction temperature range t j -55 ~ +125 ordering information device package shipping marking CSK1040J3 to-252 (pb-free) 3000 pcs / tape & reel sk1040 recommended soldering footprint
cystech electronics corp. spec. no. : c469j3 issued date : 2009.07.03 revised date : page no. : 3/6 CSK1040J3 cystek product specification characteristic curves forward current derating curve 0 2 4 6 8 10 12 0 50 100 150 casetemperature---t c () average forward current---i f(av) (a) maximum non-repetitive forward surge current 0 25 50 75 100 125 11 0 number of cycles at 60hz peak forward surge current---i fsm (a) 1 0 0 tj=25, 8.3ms single half sine wave jedec method forward current vs forward voltage 0.01 0.1 1 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 forward voltage---v f (v) instantaneous forward current---i f (a) tj=25, pulse width=300s, 1% duty cycle reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (ma) tj=75 tj=25c
cystech electronics corp. spec. no. : c469j3 issued date : 2009.07.03 revised date : page no. : 4/6 CSK1040J3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c469j3 issued date : 2009.07.03 revised date : page no. : 5/6 CSK1040J3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cystech electronics corp. spec. no. : c469j3 issued date : 2009.07.03 revised date : page no. : 6/6 CSK1040J3 cystek product specification to-252 dimension 3-lead to-252 plastic surface mount package cystek package code: j3 marking: b a c e h i j k 3 2 1 d f g l sk1040 style: pin 1.anode 2.cathode 3.anode *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0157 0.0236 0.40 0.60 g 0.0984 0.1142 2.50 2.90 b 0.0591 0.0827 1.50 2.10 h - *0.0906 - *2.30 c 0.0157 0.0315 0.40 0.80 i 0.0315 0.0394 0.80 1.00 d 0.0157 0.0236 0.40 0.60 j 0.0315 0.0394 0.80 1.00 e 0.2480 0.2638 6.30 6.70 k 0.2008 0.2165 5.10 5.50 f 0.2283 0.2441 5.80 6.20 l 0.0315 0.0394 0.80 1.00 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: kfc; pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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